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Posted by on Jun 30, 2012 in Hardware News |

ARM, HP Hynix and ST join the Memory Cube Hybrid Consortium

ARM, HP Hynix and ST join the Memory Cube Hybrid Consortium

Since last year, future reports Hybrid Memory Cube (HMC) promise to revolutionize the memory market, thanks to its 3D construction layers, which can save space, reduce consumption and increase performance from 10 to 20 times that of current DDR3.

The (HMC) is powered by Micron, which created the Memory Cube Hybrid Consortium , an organization dedicated to promoting this technology, which just joined three new and important members: ARM, HP and SK Hynix.

The union of these three major companies, in addition to IBM, Intel, Micron, Samsung and other companies of the members, makes a strong tendency hmc in the future. It expects the first products based on HMC make their appearance between 2013 and 2014.

Link: 再添新成员,ARM、HP和SK海力士加入HMC阵营 (Expreview)

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