ARM, HP Hynix and ST join the Memory Cube Hybrid Consortium
Since last year, future reports Hybrid Memory Cube (HMC) promise to revolutionize the memory market, thanks to its 3D construction layers, which can save space, reduce consumption and increase performance from 10 to 20 times that of current DDR3.
The Standard hybrid memory cube (HMC) is powered by Micron, which created the Memory Cube Hybrid Consortium , an organization dedicated to promoting this technology, which just joined three new and important members: ARM, HP and SK Hynix.
The union of these three major companies, in addition to IBM, Intel, Micron, Samsung and other companies of the consortium members, makes a strong tendency hmc in the future. It expects the first products based on HMC make their appearance between 2013 and 2014.
Link: 再添新成员，ARM、HP和SK海力士加入HMC阵营 (Expreview)Tags: arm, consortium, dram, hmc, HP, hybrid memory cube, Hynix SK, junction, Standard, together