Globalfoundries announces its manufacturing process 14XM (eXtreme Mobility)
A half year of its divestiture of AMD , Globalfoundries, the current second largest foundry industry , announces its upcoming advances in manufacturing processes.
Next year (2013) GLOBALFOUNDRIES plans to introduce its new manufacturing process traditional (planar HKMG) 20nm, and then the following year (2014) introduce their future manufacturing process to 14nm, which they call 14XM (eXtreme Mobility), and has been developed in conjunction with ST Microelectronics.
The manufacturing process is based 14XM FinFET transistor “3D”, a manufacturing process that enables the Manufacture of chips formed by transistors 2.5D (double-gate) and 3D (very similar to the Tri-Gate transistors used in the process manufacturing at 22nm Intel); according Globalfoundries, 14XM enable the manufacture of chips with a performance / watt between 20 to 55% higher and a range between 40 to 60% higher than chips made with yet released its manufacturing process to 20nm.
The manufacturing process will be focused on a wide variety of chips as SoC for portable devices, CPUs, GPUs, among other chips.14nm, 14XM, 20nm, double-gate, FDSOI, FinFET, GLOBALFOUNDRIES, HKMG, Manufacture, non-planar, planar, process, transistors, Tri-Gate