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Posted by on Jun 10, 2013 in Hardware News |

Intel Core i7-4770K “Haswell-DT” tested with Liquid Pro thermal paste between the die and the IHS

A few days ago we learned that the commercial versions of the fourth generation microprocessors “Haswell” have higher temperature, lower consumption and overclock the versions that were sent to the media .

Focusing on the relatively high temperature of the chip, it was suspected that it had to do with paste used by Intel to connect the die with (IHS) case very similar to what we saw last year in the microprocessors third generation Intel Core “Ivy Bridge” , and apparently we are not mistaken as revealed on Overclock.net.

As shipped from the factory, the Intel Core “Haswell-DT” shows a temperature of 87.5 ° C when in charge, but at the Integrated Heat Spreader remove her “IHS” and replace the factory thermal paste a higher quality (in this case Cool Laboratory Liquid Pro) was obtained which considerably reduce the chip temperature under load at 69 ° C (18.5 ° C less).

Remove the Integrated Heat Spreader (IHS) is a very delicate task that we do not recommend making because it can seriously damage the chip if it is not due care, and although the process is performed successfully lose your warranty microprocessor!

Overclock.net Cyclops User uploaded a video detailing the process and the evidence subsequently performed at the thermal paste replacement chip and a motherboard Gryphon:

Link: Core i7-4770K: sta ja irti uudet lämmönlevittäjä tahnat: lämpötila laski 18 astetta (Muropaketti)

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