Intel unveils new microprocessors Cooler for LGA 1155
Many will remember that in times of microprocessors Intel LGA 775 socket decided to change the cooler with selling its microprocessors, with a much less effective. The story could be about to repeat itself in the current microprocessors third generation Core “Ivy Bridge” for socket LGA 1155.
From Hardware.info report that Intel has introduced a new cooler for your socket lga 1155 chips in its “box”, which unlike the original model, has a sink with a circular Design at its base (the original heat sink has a square pattern), the new cooler also has mounting holes slightly larger.
Intel claims that the change reflects a purely aesthetic issue and does not affect thermal performance at all, optimizing the design while reducing the cost of manufacture.
At first glance, the amount of metal used in the new sink is smaller than the original design, and this could mean lower dissipation area and lower thermal effectiveness. We will monitor this issue to see if the claims are true Intel.
Link: Intel boxed cooler alters current processors (Hardware.info)Tags: box, boxed, circular, cooler, CPU, Design, didipacion, fan, ivy bridge, lga 1155, microprocessor, new, processor, temperature, thermal